COB for optical communication
We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. 【Features】 ○ Excellent high-frequency characteristics Optimal material selection, layer composition, and L/S can be determined through simulation, allowing for high consistency in control. ○ High-precision contour processing High-precision CCD processing can be performed to match the position of the patterns. ○ Highly reliable surface treatment Reliable plating processes for electrolytic and electroless wire bonding with gold and Ni/Pd/Au are available. *Detailed information such as "specifications" is available in the catalog. *For more information, please contact us or download the catalog.
- 企業：サトーセン
- 価格：Other
